Ion exchangeable glass article for three-dimensional forming

ABSTRACT

An alkali aluminosilicate glass that can be chemically strengthened and formed into a three dimensional shape. The glass has a softening point of less than about 825° C. and a high temperature coefficient of thermal expansion of less than about 30 parts per million (ppm)/° C. The glass may be ion exchanged after the three dimensional shape is formed. When ion exchanged, the glass has a surface layer that is under a compressive stress of at least about 700 MPa.

This application claims the benefit of priority under 35 U.S.C. § 119 ofU.S. Provisional Application Ser. No. 61/945,430, filed on Feb. 27,2014, the content of which is relied upon and incorporated herein byreference in its entirety.

BACKGROUND

The disclosure relates to a glass that is formable into threedimensional shapes. More particularly, the disclosure relates to an ionexchanged glass that is formable into three dimensional shapes. Evenmore particularly, the disclosure relates to such glasses having a lowsoftening point.

Shaped glass articles are entering use as outer covers or enclosureelements in consumer electronics such as mobile phones and tablets.Currently, these articles are made by molding the glass.

SUMMARY

The present disclosure meets these and other needs by providing analkali aluminosilicate glass that can be chemically strengthened andformed into a three dimensional shape. The glass has a softening pointof less than about 825° C. and a high temperature coefficient of thermalexpansion of less than about 30 parts per million (ppm)/° C. The glassmay be ion exchanged after the three dimensional shape is formed. Whenion exchanged, the glass has a surface layer that is under a compressivestress of at least about 700 MPa.

Accordingly, one aspect of the disclosure is to provide a glass articlecomprising at least about 50 mol % SiO₂, at least about 8 mol % Al₂O₃,at least about 1 mol % P₂O₅, and at least about 12 mol % Na₂O. The glassarticle is ion exchangeable and has a softening point of less than orequal to about 825° C., and a high temperature coefficient of thermalexpansion of less than or equal to 30 ppm/° C.

A second aspect of the disclosure is to provide a glass articlecomprising at least about 50 mol % SiO₂, at least about 8 mol % Al₂O₃,at least about 1 mol % P₂O₅, and at least about 12 mol % Na₂O. The glassarticle is ion exchanged and has a compressive layer extending from asurface of the glass article to a depth of layer within the article,wherein the compressive layer has a maximum compressive stress of atleast about 700 MPa. The glass article has a softening point of lessthan or equal to about 825° C. and a high temperature coefficient ofthermal expansion of less than or equal to 29 ppm/° C.

These and other aspects, advantages, and salient features will becomeapparent from the following detailed description, the accompanyingdrawings, and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plot of instantaneous coefficient of thermal expansion as afunction of temperature for sample 20 in Table 1;

FIG. 2 is a cross-sectional schematic view of dish-shaped glassarticles; and

FIG. 3 is a cross-sectional schematic view of a planar ion exchangedglass article.

DETAILED DESCRIPTION

In the following description, like reference characters designate likeor corresponding parts throughout the several views shown in thefigures. It is also understood that, unless otherwise specified, termssuch as “top,” “bottom,” “outward,” “inward,” and the like are words ofconvenience and are not to be construed as limiting terms. In addition,whenever a group is described as comprising at least one of a group ofelements and combinations thereof, it is understood that the group maycomprise, consist essentially of, or consist of any number of thoseelements recited, either individually or in combination with each other.Similarly, whenever a group is described as consisting of at least oneof a group of elements or combinations thereof, it is understood thatthe group may consist of any number of those elements recited, eitherindividually or in combination with each other. Unless otherwisespecified, a range of values, when recited, includes both the upper andlower limits of the range as well as any ranges therebetween. As usedherein, the indefinite articles “a,” “an,” and the correspondingdefinite article “the” mean “at least one” or “one or more,” unlessotherwise specified. It also is understood that the various featuresdisclosed in the specification and the drawings can be used in any andall combinations.

As used herein, the terms “glass article” and “glass articles” are usedin their broadest sense to include any object made wholly or partly ofglass. Unless otherwise specified, all compositions are expressed interms of mole percent (mol %). High temperature coefficients of thermalexpansion (high temperature CTE) are expressed in terms of part permillion (ppm) per degree Celsius (ppm/° C.), and represent a valuemeasured in the high temperature plateau region of the instantaneous CTEvs. temperature curve.

Unless otherwise specified, all temperatures are expressed in terms ofdegrees Celsius (° C.). As used herein the term “softening point” refersto the temperature at which the viscosity of a glass is approximately10⁷⁶ poise (P), the term “anneal point” refers to the temperature atwhich the viscosity of a glass is approximately 10^(13.2) poise, theterm “200 poise temperature (T^(200P))” refers to the temperature atwhich the viscosity of a glass is approximately 200 poise, the term “1poise temperature (T^(200P))” refers to the temperature at which theviscosity of a glass is approximately 200 poise, the term “10¹¹ poisetemperature” refers to the temperature at which the viscosity of a glassis approximately 10¹¹ poise, the term “35 kP temperature (T^(35kP))”refers to the temperature at which the viscosity of a glass isapproximately 35 kilopoise (kP), and the term “160 kP temperature(T^(160kP))” refers to the temperature at which the viscosity of a glassis approximately 160 kP.

As used herein, the term “zircon breakdown temperature” or“T^(breakdown)” refers to the temperature at which zircon—which iscommonly used as a refractory material in glass processing andmanufacture—breaks down to form zirconia and silica, and the term“zircon breakdown viscosity” refers to the viscosity of the glass atT^(breakdown). The term “liquidus viscosity” refers to the viscosity ofa molten glass at the liquidus temperature, wherein the liquidustemperature refers to the temperature at which crystals first appear asa molten glass cools down from the melting temperature, or thetemperature at which the very last crystals melt away as temperature isincreased from room temperature.

It is noted that the terms “substantially” and “about” may be utilizedherein to represent the inherent degree of uncertainty that may beattributed to any quantitative comparison, value, measurement, or otherrepresentation. These terms are also utilized herein to represent thedegree by which a quantitative representation may vary from a statedreference without resulting in a change in the basic function of thesubject matter at issue. Thus, a glass that is “substantially free oflithium,” for example is one in which lithium and compounds formed bylithium is not actively added or batched into the glass, but may bepresent in very small amounts as a contaminant.

Vickers crack initiation thresholds described herein are determined byapplying and then removing an indentation load to the glass surface at arate of 0.2 mm/min. The maximum indentation load is held for 10 seconds.The indentation cracking threshold is defined at the indentation load atwhich 50% of 10 indents exhibit any number of radial/median cracksemanating from the corners of the indent impression. The maximum load isincreased until the threshold is met for a given glass composition. Allindentation measurements are performed at room temperature in 50%relative humidity.

As used herein, “maximum compressive stress” refers to the highestcompressive stress value measured within the compressive layer. In someembodiments, the maximum compressive stress is located at the surface ofthe glass and may appear as a “spike” in the compressive stress profile.In other embodiments, the maximum compressive stress may occur at adepth below the surface, giving the compressive profile the appearanceof a “buried peak.” Compressive stress and depth of layer are measuredusing those means known in the art. Such means include, but are notlimited to, measurement of surface stress (FSM) using commerciallyavailable instruments such as the FSM-6000, manufactured by Luceo Co.,Ltd. (Tokyo, Japan), or the like, and methods of measuring compressivestress and depth of layer are described in ASTM 1422C-99, entitled“Standard Specification for Chemically Strengthened Flat Glass,” andASTM 1279.19779 “Standard Test Method for Non-Destructive PhotoelasticMeasurement of Edge and Surface Stresses in Annealed, Heat-Strengthened,and Fully-Tempered Flat Glass,” the contents of which are incorporatedherein by reference in their entirety. Surface stress measurements relyupon the accurate measurement of the stress optical coefficient (SOC),which is related to the birefringence of the glass and expressed innm/mm/MPa. SOC in turn is measured by those methods that are known inthe art, such as fiber and four point bend methods, both of which aredescribed in ASTM standard C770-98 (2008), entitled “Standard TestMethod for Measurement of Glass Stress-Optical Coefficient,” thecontents of which are incorporated herein by reference in theirentirety, and a bulk cylinder method.

As used herein, the term “three dimensional shape” refers to a shape orform other than a flat sheet. The three dimensional shape does not liein a plane. Non-limiting examples of three dimensional glass articlesare shown in FIG. 2. Dish-shaped article 200 has two major surfaces 202,204 each of which has a substantially flat or planar portion 210,bounded on either end (or, alternatively, on both ends) by a curvedportion 220 to provide a dish-shaped profile or appearance. In otherembodiments, dish-shaped article 230 has only one major surface 234having a substantially flat or planar portion 210, bounded on either end(or, alternatively, on both ends) by a curved portion 220. The remainingmajor surface 232 is substantially flat or planar.

Referring to the drawings in general and to FIG. 1 in particular, itwill be understood that the illustrations are for the purpose ofdescribing particular embodiments and are not intended to limit thedisclosure or appended claims thereto. The drawings are not necessarilyto scale, and certain features and certain views of the drawings may beshown exaggerated in scale or in schematic in the interest of clarityand conciseness.

In order for a glass to be formable into a three dimensional shape foruse a cover glass in hand held electronic devices, the glass should havea low softening point to facilitate shaping and a sufficiently lowcoefficient of thermal expansion (CTE) at high temperature to preventcracking. In addition, the glass should be ion exchangeable to achieve asurface compressive stress that is sufficient to prevent damage due toimpact.

Described herein is a family of glasses that are fusion formable, ionexchangeable, and formable into three dimensional shapes. The glasscomprises at least about 50 mol % SiO₂; at least about 8 mol % Al₂O₃; atleast about 1 mol % P₂O₅; and at least about 12 mol % Na₂O, and has asoftening point of less than or equal to about 825° C. and a hightemperature coefficient of thermal expansion (high temperature CTE) ofless than or equal to about 30 ppm/° C. In some embodiments, thesoftening point of the glasses described herein is less than or equal toabout 800° C. and, in still other embodiments, less than or equal toabout 775° C.

As previously mentioned, the high temperature coefficient of thermalexpansion is taken as the instantaneous coefficient of thermal expansionof the glass at high temperatures. FIG. 1 is a plot of instantaneouscoefficient of thermal expansion as a function of temperature for sample20 in Table 1. The high temperature CTE of this glass sample is theinstantaneous CTE at the high temperature plateau occurring at about675° C. In some embodiments, the high temperature coefficient of thermalexpansion is less than or equal to about 29 ppm/° C. and, in otherembodiments, less than or equal to about 27 ppm/° C. Exemplarycompositions of these glasses are listed in Table 1. Softening points,high temperature coefficients of thermal expansion, and other physicalproperties of the glasses listed in Table 1, including strain points,anneal points, T^(200P), 10¹¹ poise temperature, T^(35kP),T^(breakdown), zircon breakdown viscosity, T^(160kP) liquidustemperature, liquidus viscosity, refractive index, and SOC, are listedin Table 2.

TABLE 1 Compositions of glasses. Analyzed Composition (mol %) 1 2 3 4 56 SiO₂ 58.30 58.48 58.41 58.71 59.06 59.01 Al₂O₃ 15.60 14.45 13.56 12.6411.74 10.69 P₂O₅ 4.76 4.76 4.82 4.74 4.67 4.68 B₂O₃ 5.05 5.14 5.16 4.924.79 4.81 Na₂O 13.31 14.27 15.17 16.08 16.73 17.85 ZnO 2.98 2.90 2.882.92 3.00 2.96 SnO₂ 0.00 0.00 0.00 0.00 0.00 0.00 (R₂O + RO + B₂O₃)/0.27 0.29 0.30 0.31 0.33 0.34 (Al₂O₃ + P₂O5 + SiO₂) Analyzed Composition(mol %) 7 8 9 10 11 12 SiO₂ 57.73 57.88 57.91 57.82 58.19 58.27 Al₂O₃15.51 14.52 13.63 12.61 11.71 10.71 P₂O₅ 4.87 4.81 4.77 4.88 4.75 4.88B₂O₃ 4.97 4.92 4.89 4.82 4.53 4.49 Na₂O 13.09 14.06 14.90 15.95 16.9217.66 ZnO 3.82 3.80 3.90 3.93 3.90 3.99 SnO₂ 0.00 0.00 0.00 0.00 0.000.00 (R₂O + RO + B₂O₃)/ 0.28 0.30 0.31 0.33 0.34 0.35 (Al₂O₃ + P₂O5 +SiO₂) Analyzed Composition (mol %) 13 14 15 16 17 18 SiO₂ 56.52 55.1156.69 56.69 57.11 57.36 Al₂O₃ 15.49 14.52 13.53 12.55 11.62 10.70 P₂O₅4.83 4.88 4.81 4.78 4.72 4.70 B₂O₃ 5.00 5.08 4.87 4.90 4.63 4.47 Na₂O13.08 14.35 14.93 15.91 16.80 17.62 ZnO 5.09 6.05 5.16 5.17 5.12 5.15SnO₂ 0.00 0.00 0.00 0.00 0.00 0.00 (R₂O + RO + B₂O₃)/ 0.30 0.34 0.330.35 0.36 0.37 (Al₂O₃ + P₂O5 + SiO₂) Analyzed Composition (mol %) 19 2021 22 23 24 SiO₂ 58.31 56.68 58.64 57.51 57.69 53.73 Al₂O₃ 12.68 12.5312.50 12.49 12.76 14.52 P₂O₅ 4.70 4.87 4.87 4.88 4.72 4.93 B₂O₃ 4.694.93 5.03 5.12 4.47 5.04 Na₂O 16.72 18.12 17.02 18.03 18.48 17.89 ZnO2.90 2.87 1.95 1.97 1.88 3.88 SnO₂ 0.00 0.00 0.00 0.00 0.00 0.00 (R₂O +RO + B₂O₃)/ 0.32 0.35 0.32 0.34 0.33 0.37 (Al₂O₃ + P₂O5 + SiO₂) AnalyzedComposition (mol %) 25 26 27 28 29 30 SiO₂ 53.61 53.61 54.12 54.08 54.9356.37 Al₂O₃ 14.50 14.42 14.71 14.58 14.73 12.59 P₂O₅ 3.95 5.87 2.95 6.664.75 5.04 B₂O₃ 6.01 4.06 6.64 3.05 4.53 5.01 Na₂O 17.93 17.96 17.6117.81 17.64 19.09 ZnO 4.00 4.08 3.97 3.83 3.43 1.90 SnO₂ 0.00 0.00 0.000.00 0.00 0.00 (R₂O + RO + B₂O₃)/ 0.39 0.35 0.39 0.33 0.34 0.35 (Al₂O₃ +P₂O5 + SiO₂) Analyzed Composition (mol %) 31 32 33 34 35 36 SiO₂ 56.2156.89 56.06 56.80 57.04 53.13 Al₂O₃ 12.58 12.73 12.53 12.35 12.85 15.15P₂O₅ 5.98 4.01 7.14 2.88 2.08 2.92 B₂O₃ 4.02 5.49 2.94 6.73 7.24 6.51Na₂O 19.31 18.93 19.41 19.29 18.72 18.84 ZnO 1.90 1.95 1.92 1.95 2.073.46 SnO₂ 0.00 0.00 0.00 0.00 0.00 0.00 (R₂O + RO + B₂O₃)/ 0.34 0.360.32 0.39 0.39 0.40 (Al₂O₃ + P₂O5 + SiO₂) Analyzed Composition (mol %)37 38 39 40 41 42 SiO₂ 53.02 52.76 52.98 52.69 53.86 54.33 Al₂O₃ 15.1315.21 15.29 15.76 15.22 14.99 P₂O₅ 2.92 2.94 2.94 3.00 2.06 2.08 B₂O₃6.61 6.32 6.29 6.39 7.49 7.41 Na₂O 18.37 18.83 19.10 18.79 17.66 16.95ZnO 3.94 3.94 3.40 3.37 3.71 4.23 SnO₂ 0.00 0.00 0.00 0.00 0.00 0.00(R₂O + RO + B₂O₃)/ 0.41 0.41 0.40 0.40 0.41 0.40 (Al₂O₃ + P₂O5 + SiO₂)Analyzed Composition (mol %) 43 44 45 46 47 48 49 SiO₂ 54.15 53.96 53.9354.07 53.98 53.93 53.91 Al₂O₃ 15.47 14.59 15.19 14.52 14.74 14.69 14.80P₂O₅ 1.58 2.43 2.44 1.45 2.49 2.47 2.45 B₂O₃ 7.78 7.24 7.17 8.18 7.217.27 7.08 Na₂O 17.27 17.88 17.81 17.83 17.56 17.67 17.73 ZnO 3.75 3.893.46 3.95 4.02 3.97 3.89 SnO₂ 0.00 0.00 0.00 0.00 0.00 0.00 0.14 (R₂O +RO + B₂O₃)/ 0.40 0.41 0.40 0.43 0.40 0.41 0.40 (Al₂O₃ + P₂O5 + SiO₂)

TABLE 2 Physical properties of the glasses listed in Table 1. Sample 1 23 4 5 6 Softening Point 882.1 841.5 821.9 805.2 805.7 808.6 CTE 19.3822.34 24 27 27 27.22 Strain Point 559 528 521 520 524 524 Anneal Point614 579 568 562 562 563 T^(200P) 1620 1601 1584 1557 1532 1487 10¹¹ P705 666 650 638 633 636 Temperature T^(35k-P) 1184 1156 1131 1097 10701033 T^(breakdown) >1290 Zircon <2528 Breakdown Viscosity (P) T^(160kP)1099 1069 1044 1011 985 951 Liquidus 870 Temperature Liquidus 3.74 × 10⁶Viscosity (P) Refractive 1.4949 1.4956 1.4957 1.4969 1.4966 1.4957 IndexSOC 3.472 3.436 3.434 3.341 3.319 3.282 Sample 7 8 9 10 11 12 SofteningPoint 854.2 847.6 815.8 810.8 817.5 815.7 CTE 20.6 22.1 22.2 25.8 27.925.5 Strain Point 541 532 522 532 528 Anneal Point 595 583 565 571 569T^(200P) 1593 1582 1570 1547 1515 1485 10¹¹ P 685 671 642 644 644Temperature T^(35kP) 1165 1146 1128 1094 1066 1037 T^(breakdown) ZirconBreakdown Viscosity (P) T^(160kP) 1081 1060 1041 1009 982 955 LiquidusTemperature Liquidus Viscosity (P) Refractive Index 1.497 1.4971 1.49731.499 1.4985 1.496 SOC 3.482 3.505 3.504 3.442 3.354 3.337 Sample 13 1415 16 17 18 Softening Point 843.8 832.6 813.8 834.6 819.9 821 CTE 20.721.44 21.9 24.25 28.14 26.33 Strain Point 545 530 520 535 536 535 AnnealPoint 595 579 566 575 577 576 T^(200P) 1558 1565 1541 1517 1495 146110¹¹ P 679 663 646 650 651 651 Temperature T^(35kP) 1142 1131 1109 10781057 1025 T^(breakdown) Zircon Breakdown Viscosity (P) T^(160kP) 10591047 1024 995 976 945 Liquidus Temperature Liquidus Viscosity (P)Refractive Index SOC 3.494 3.486 3.497 3.467 3.408 3.349 Sample 19 20 2122 23 24 Softening Point 798.1 779.2 780.7 771.3 766.4 786.4 CTE 29 2929 28 27 27.2 Strain Point 524 514 513 513 512 515 Anneal Point 566 554557 555 553 558 T^(200P) 1543 1500 1546 1514 1504 1492 10¹¹ P 640 625632 627 624 633 Temperature T^(35kP) 1094 1055 1085 1057 1052 1067T^(breakdown) Zircon Breakdown Viscosity (P) T^(160kP) 1007 971 997 972968 986 Liquidus Temperature Liquidus Viscosity (P) Refractive Index1.4958 1.4965 1.4968 1.5018 SOC 3.321 3.327 3.252 3.246 3.234 3.349Sample 25 26 27 28 29 30 Softening 777.9 792.6 770.4 799.5 803.1 759.9Point CTE 27.3 26 28.56 26 25.4 29.15 Strain Point 514 519 516 518 527509 Anneal 557 562 559 563 572 549 Point T^(200P) 1483 1513 1480 15221517 1488 10¹¹ P 631 637 631 641 649 618 Temperature T^(35kP) 1056 10861054 1093 1089 1038 T^(breakdown) 1110 Zircon 14008 Breakdown Viscosity(P) T^(160kP) 976 1003 974 1011 1006 955 Liquidus 820 TemperatureLiquidus 7.09 × 10⁶ Viscosity (P) Refractive 1.5037 1.5003 1.5056 1.49891.5001 1.49642 Index SOC 3.407 3.321 3.369 3.249 3.393 3.206 Sample 3132 33 34 35 36 Softening 771.5 751.4 773.4 737 738.6 770.7 Point CTE27.51 30.9 28.6 34.29 35.2 29.61 Strain Point 510 515 506 516 518 522Anneal 551 556 548 555 558 564 Point T^(200P) 1496 1480 1512 1447 14651465 10¹¹ P 623 624 621 619 622 634 Temperature T^(35kP) 1048 1029 1066999 1008 1048 T^(breakdown) Zircon Breakdown Viscosity (P) T^(160kP) 965946 982 919 928 969 Liquidus Temperature Liquidus Viscosity (P)Refractive 1.49431 1.49889 1.49445 1.50233 1.50475 1.5044 Index SOC3.124 3.181 3.077 3.172 3.217 3.388 Sample 37 38 39 40 41 42 Softening770.2 765.6 773.3 785.3 772.3 769 Point CTE 29.62 28.92 29.75 28.2628.27 29.42 Strain Point 521 522 524 523 517 509 Anneal 563 563 567 566561 551 Point T^(200P) 1465 1450 1468 1477 1468 1456 10¹¹ P 634 632 638639 634 623 Temperature T^(35kP) 1047 1038 1046 1057 1050 1039T^(breakdown) Zircon Breakdown Viscosity (P) T^(160kP) 968 960 966 977968 958 Liquidus 820 795 Temperature Liquidus 5.29 × 10⁶ 7.88 × 10⁶Viscosity (P) Refractive 1.5052 1.5057 1.5089 1.5046 1.5087 1.5079 IndexSOC 3.424 3.425 3.344 3.369 3.41 3.434 Sample 43 44 45 46 47 48 49Softening 778 762.4 772.3 759 766.8 763.5 767.7 Point CTE 28.41 28.828.3 30.5 28.6 30.04 28.08 Strain Point 521 517 518 516 513 511 516Anneal 565 559 562 558 555 553 558 Point T^(200P) 1476 1466 1475 14511467 1479 1443 10¹¹ P 638 629 635 628 626 624 629 Temperature T^(35kP)1062 1043 1061 1032 1048 1040 1039 T^(breakdown) 1075 1075 Zircon 2212118989 Breakdown Viscosity (P) T^(160kP) 980 963 979 952 968 962 960Liquidus 805 1090 770 Temperature Liquidus 1.12 × 10⁷ 1.73 × 10⁴ 2.15 ×10⁷ Viscosity (P) Refractive 1.5065 1.5064 1.5052 1.5086 1.5065 1.50691.5062 Index SOC 3.419 3.439 3.397 3.419 3.41 3.41 3.408

In some embodiments, the glasses described herein may be formed into athree dimensional shape using those means known in the art, includingmolding or the like. Non-limiting examples of such three dimensionalshapes include those articles in which at least one surface has adish-shaped, curved, convex, or concave profile. Dish-shaped articlesmay have a substantially flat portion bounded on at least one side by acurved portion. Non-limiting examples of dish-shaped glass ceramicarticles are schematically shown in cross-sectional views in FIG. 2.Dish-shaped article 200 has two major surfaces 202, 204 each of whichhas a substantially flat or planar portion 210, bounded on either end(or, alternatively, on both ends) by a curved portion 220 to provide adish-shaped profile or appearance. In other embodiments, dish-shapedarticle 230 has only one major surface 234 having a substantially flator planar portion 210, bounded on either end (or, alternatively, on bothends) by a curved portion 220. The remaining major surface 232 issubstantially flat or planar.

Ion exchange is widely used to chemically strengthen glasses. In oneparticular example, alkali cations within a source of such cations(e.g., a molten salt, or “ion exchange,” bath) are exchanged withsmaller alkali cations within the glass to achieve a layer that is undera compressive stress (CS) near the surface of the glass. The compressivelayer extends from the surface to a depth of layer (DOL) within theglass. In the glasses described herein, for example, potassium ions fromthe cation source are exchanged for sodium ions within the glass duringion exchange by immersing the glass in a molten salt bath comprising apotassium salt such as, but not limited to, potassium nitrate (KNO₃).Other potassium salts that may be used in the ion exchange processinclude, but are not limited to, potassium chloride (KCl), potassiumsulfate (K₂SO₄), combinations thereof, and the like.

A cross-sectional schematic view of a planar ion exchanged glass articleis shown in FIG. 3. Glass article 300 has a thickness t, first surface310, and second surface 312. While the embodiment shown in FIG. 3depicts glass article 300 as a flat planar sheet or plate, glass articlemay have other configurations, such as three dimensional shapes ornon-planar configurations. Glass article 300 has a first compressivelayer 320 extending from first surface 310 to a depth of layer d₁ intothe bulk of the glass article 300. In the embodiment shown in FIG. 3,glass article 300 also has a second compressive layer 322 extending fromsecond surface 312 to a second depth of layer d₂. Glass article also hasa central region 330 that extends from d₁ to d₂. Central region 330 isunder a tensile stress or central tension (CT), which balances orcounteracts the compressive stresses of layers 320 and 322. The depthd₁, d₂ of first and second compressive layers 320, 322 protects theglass article 300 from the propagation of flaws introduced by sharpimpact to first and second surfaces 310, 312 of glass article 300, whilethe compressive stress minimizes the likelihood of a flaw penetratingthrough the depth d₁, d₂ of first and second compressive layers 320,322.

The glass articles described herein may be ion exchanged after beingformed into a three dimensional shape. In non-limiting examples, theglass is annealed at the temperature defined by the 10^(13.2) poiseviscosity of the glass and ion exchanged in a molten potassium nitratebath for either four, eight, or 10 hours. The ion exchange bath maycomprise nearly 100% KNO₃ by weight. In some embodiments, the ionexchange bath may comprise eat least about 95% KNO₃ by weight and, inother embodiments, at least about 92% KNO₃ by weight. The compressivelayer comprises K₂O and has a maximum compressive stress of at leastabout 700 MPa. In some embodiments, the compressive layer or layers(320, 322 in FIG. 3) may have a maximum compressive stress CS of atleast about 700 MPa. In other embodiments the maximum compressive stressis at least about 800 MPa and, in still other embodiments, at leastabout 900 MPa. The depth of layer DOL (d₁, d₂ in FIG. 3) of each ofcompressive layers 320, 322 is, in some embodiments, at least 20 μm. Inother embodiments, the depth of layer is at least about 30 μm.

Table 3 lists compressive stresses (CS), depths of layer (DOL), andVickers crack indentation thresholds obtained by ion exchange of theglasses listed in Table 1. In a first set of ion exchange experiments, 1mm thick samples were first annealed at the temperature defined by the10^(13.2) poise viscosity of the glass and then ion exchanged at 410° C.in a KNO₃ bath for four hours. In a second set of experiments, 1 mmthick samples were first heated to the 10¹¹ poise temperature andquenched to room temperature in order to simulate the thermal historyproduced in the fusion draw process. These quenched samples were thenion exchanged at 410° C. in a KNO₃ bath for four hours.

TABLE 3 Compressive stresses (CS), depths of layer (DOL), and Vickerscrack indentation thresholds obtained by ion exchange of the glasseslisted in Table 1. Sample 1 2 3 4 5 6 Annealed CS (MPa) 776 803 873 903803 720 DOL (μm) 31 34 34 36 38 39 Indentation 30-40 30-40 20-30 <10 <10<10 threshold (kgf) Heated at 10¹¹ poise, quenched CS (MPa) 707 690 773762 676 568 DOL (μm) 36 38 42 44 46 48 Indentation 30-40 30-40 20-30 <10<10 <10 threshold (kgf) Sample 7 8 9 10 11 12 Annealed CS (MPa) 776 803873 903 803 787 DOL (μm) 31 34 34 36 38 36 Indentation 30-40 30-40 20-30<10 <10 <10 threshold (kgf) Heated at 10¹¹ poise, quenched CS (MPa) 707690 773 762 676 606 DOL (μm) 36 38 42 44 46 45 Indentation 30-40 30-4020-30 <10 <10 10-20 threshold (kgf) Sample 13 14 15 16 17 18 Annealed CS(MPa) 1045 DOL (μm) 32 Indentation <10 threshold (kgf) Heated at 10¹¹poise, quenched CS (MPa) 689 705 913 825 808 649 DOL (μm) 29 33 41 38 4143 Indentation 20-30 20-30 10-20 20-30 <10 <10 threshold (kgf) Sample 1920 21 22 23 24 Annealed Sample 19 20 21 22 23 24 CS (MPa) 866 809 814736 739 1010 DOL (μm) 38 40 41 44 44 34 Indentation <10 <10 10-20 <10<10 <10 threshold (kgf) Heated at 10¹¹ poise, quenched CS (MPa) 744 693666 602 620 843 DOL (μm) 46 47 49 50 54 43 Indentation <10 <10 10-20 <10<10 <10 threshold (kgf) Sample 25 26 27 28 29 Annealed CS (MPa) 1034 994885 991 DOL (μm) 30 25 46 36 Indentation <10 <10 10-20 <10 10-20threshold (kgf) Heated at 10¹¹ poise, quenched CS (MPa) 851 828 830 776813 DOL (μm) 37 49 33 54 46 Indentation <10 <10 10-20 <10 10-20threshold (kgf)

In some embodiments, the glasses described herein comprise: at leastabout 50 mol % SiO₂ (i.e., SiO₂ >50 mol %); from about 10 mol % to about20 mol % Al₂O₃ (i.e., 10 mol %<Al₂O₃ <20 mol %); from about 1 mol % toabout 8 mol % P₂O₅ (i.e., 1 mol %<P₂O₅ <8 mol %); from about 2 mol % toabout 10 mol % B₂O₃ (i.e., 2 mol %<B₂O₃<10 mol %); and from about 14 mol% to about 20 mol % Na₂O (i.e., 14 mol %<Na₂O<20 mol %). The glass mayfurther comprise from about 1 mol % to about 7 mol % ZnO (i.e., 1 mol%<ZnO <7 mol %).

In some embodiments, Al₂O₃(mol %)>P₂O₅(mol %)+B₂O₃(mol %) and Al₂O₃(mol%)>B₂O₃(mol %) and, in some embodiments, Na₂O(mol %)>Al₂O₃(mol %). Insome embodiments, 0.3≤[(R₂O(mol %)+RO(mol %)+B₂O₃(mol %)]/[Al₂O₃(mol%)+P₂O₅ (mol %)+SiO₂ (mol %)]≤0.45, where R₂O are monovalent cationoxides and RO are divalent cation oxides. In some embodiments, the glassis substantially free of at least one of lithium, potassium, alkalineearth metals, and compounds thereof.

Each of the oxide components of the base and ion exchanged glassesdescribed herein serves a function. Silica (SiO₂), for example, is theprimary glass forming oxide, and forms the network backbone for themolten glass. Pure SiO₂ has a low CTE and is alkali metal-free. Due toits extremely high melting temperature, however, pure SiO₂ isincompatible with the fusion draw process. The viscosity curve is alsomuch too high to match with any core glass in a laminate structure. Insome embodiments, the glasses described herein comprise at least about50 mol % SiO₂, in other embodiments, from about 50 mol % to about 65 mol% SiO₂, and, in other embodiments, from about 50 mol % to about 60 mol %SiO₂.

In addition to silica, the glasses described herein comprise the networkformers Al₂O₃ and B₂O₃ to achieve stable glass formation, low CTE, lowYoung's modulus, low shear modulus, and to facilitate melting andforming. Like SiO₂, Al₂O₃ contributes to the rigidity to the glassnetwork. Alumina can exist in the glass in either fourfold or fivefoldcoordination. In some embodiments, the glasses described herein comprisefrom about 10 mol % to about 20 mol % Al₂O₃ and, in particularembodiments, from about 12 mol % to about 16 mol % mol % Al₂O₃.

Phosphorous pentoxide (P₂O₅) is a network former incorporated in theseglasses. P₂O₅ adopts a quasi-tetrahedral structure in the glass network;i.e., it is coordinated with four oxygen atoms, but only three of whichare connected to the rest of the network. The fourth oxygen is aterminal oxygen that is doubly bound to the phosphorous cation.Association of boron with phosphorus in the glass network can lead to amutual stabilization of these network formers in tetrahedralconfigurations, as with SiO₂. Like B₂O₃, the incorporation of P₂O₅ inthe glass network is highly effective at reducing Young's modulus andshear modulus. Incorporating P₂O₅ in the glass network also reduces thehigh temperature CTE, increases the ion-exchange interdiffusion rate,and improves glass compatibility with zircon refractory materials. Insome embodiments, the glasses described herein comprise from about 1 mol% to about 8 mol % P₂O₅.

Boron oxide (B₂O₃) is also a glass-forming oxide that is used to reduceviscosity and thus improves the ability to melt and form glass. B₂O₃ canexist in either threefold or fourfold coordination in the glass network.Threefold coordinated B₂O₃ is the most effective oxide for reducing theYoung's modulus and shear modulus, thus improving the intrinsic damageresistance of the glass. Accordingly, the glasses described herein, insome embodiments, comprises from about 2 mol % to about 10 mol % B₂O₃and, in other embodiments, from about 5 mol % to about 8 mol % B₂O₃. Thepresence of both B₂O₃ and P₂O₅ in the glass enhances the mechanicalperformance of the glass by increasing the inherent damage resistance(IDR) of the glass. When ion exchanged, the glasses described hereinexhibit Vickers indentation thresholds ranging from about 10 kgf toabout 20 kgf.

The alkali oxide Na₂O is used to achieve chemical strengthening of theglass by ion exchange. The glasses described herein include Na₂O, whichcan be exchanged for potassium in a salt bath containing, for example,KNO₃. In some embodiments, the glass comprises from about 14 mol % toabout 20 mol % Na₂O and, in other embodiments, from about 15 mol % toabout 20 mol % Na₂O.

Like B₂O₃, the divalent oxide ZnO also improves the melting behavior ofthe glass by reducing the temperature at 200 poise viscosity (200Ptemperature). ZnO also is beneficial in improving the strain point whencompared to like additions of P₂O₅, B₂O₃, and/or Na₂O. In someembodiments, the glasses described herein comprise from about 1 mol % upto about 7 mol % ZnO and, in other embodiments, from about 2 mol % toabout 5 mol % ZnO.

Alkaline earth oxides, including MgO and CaO, may also be substitutedfor ZnO to achieve a similar effect on the 200P temperature and strainpoint. When compared to MgO and CaO, however, ZnO is less prone topromoting phase separation in the presence of P₂O₅. Other alkaline earthoxides, including SrO and BaO, may also be substituted for ZnO, but areless effective in reducing the melt temperature at 200 poise viscositythan ZnO, MgO, or CaO and are also less effective than ZnO, MgO, or CaOat increasing the strain point.

In some embodiments, the base glasses described herein are formable bydown-draw processes that are known in the art, such as slot-draw andfusion-draw processes. The base glass compositions containing smallconcentrations of Li₂O are fully compatible with the fusion-draw processand can be manufactured without issue. The lithium can be batched aseither spodumene or lithium carbonate.

The fusion draw process is an industrial technique that has been usedfor the large-scale manufacture of thin glass sheets. Compared to otherflat glass manufacturing techniques, such as the float or slot drawprocesses, the fusion draw process yields thin glass sheets withsuperior flatness and surface quality. As a result, the fusion drawprocess has become the dominant manufacturing technique in thefabrication of thin glass substrates for liquid crystal displays, aswell as for cover glass for personal electronic devices such asnotebooks, entertainment devices, tables, laptops, and the like.

The fusion draw process involves the flow of molten glass over a troughknown as an “isopipe,” which is typically made of zircon or anotherrefractory material. The molten glass overflows the top of the isopipefrom both sides, meeting at the bottom of the isopipe to form a singlesheet where only the interior of the final sheet has made direct contactwith the isopipe. Since neither exposed surface of the final glass sheethas made contact with the isopipe material during the draw process, bothouter surfaces of the glass are of pristine quality and do not requiresubsequent finishing.

In order to be fusion drawable, a glass must have a sufficiently highliquidus viscosity (i.e., the viscosity of a molten glass at theliquidus temperature). In some embodiments, the glasses described hereinhave a liquidus viscosity of at least about 100 kilopoise (kpoise), inother embodiments, at least about 120 kpoise, and in still otherembodiments, these glasses have a liquidus viscosity of at least about300 kpoise.

While typical embodiments have been set forth for the purpose ofillustration, the foregoing description should not be deemed to be alimitation on the scope of the disclosure or appended claims.Accordingly, various modifications, adaptations, and alternatives mayoccur to one skilled in the art without departing from the spirit andscope of the present disclosure or appended claims.

The invention claimed is:
 1. A glass article, the glass articlecomprising from 50 mol % to 60 mol % SiO₂; at least about 8 mol % Al₂O₃;at least about 1 mol % P₂O₅; about 1 mol % to about 7 mol % ZnO; and atleast 12 mol % Na₂O, wherein the glass article is substantially freefrom potassium, the glass article is ion exchangeable and has asoftening point of less than or equal to 825° C., a high temperaturecoefficient of thermal expansion of less than or equal to 30 ppm/° C.,and Al₂O₃(mol %)>P₂O₅(mol %)+B₂O₃(mol %).
 2. An ion exchanged glassarticle, wherein the ion exchanged glass article is the glass article ofclaim 1 after being ion exchanged and has a compressive layer extendingfrom a surface of the glass article to a depth of layer within thearticle, the compressive layer having a maximum compressive stress of atleast 700 MPa.
 3. The ion exchanged glass article of claim 2, whereinthe maximum compressive stress is at least 800 MPa.
 4. The ion exchangedglass article of claim 3, wherein the maximum compressive stress is atleast 900 MPa.
 5. The ion exchanged glass article of claim 2, whereinthe depth of layer is at least 20 μm.
 6. The ion exchanged glass articleof claim 2, wherein the glass has a Vickers crack initiation thresholdof at least 10 kgf.
 7. The glass article of claim 1, wherein the glassarticle comprises: from 10 mol % to 20 mol % Al₂O₃; from about 1.45 mol% to 8 mol % P₂O₅; from 2 mol % to 10 mol % B₂O₃; and from about 14 mol% to about 20 mol % Na₂O.
 8. The glass article of claim 7, wherein theglass article comprises from about 1 mol % to about 7 mol % ZnO.
 9. Theglass article of claim 7, wherein Al₂O₃(mol %)>B₂O₃(mol %), and Na₂O(mol%)>Al₂O₃(mol %).
 10. The glass article of claim 7, wherein 0.3≤[(R₂O(mol%)+RO(mol %) +B₂O₃(mol %)]/[(Al₂O₃(mol %)+P₂O₅ (mol %)+SiO₂ (mol%)]≤0.45, where R₂O are monovalent cation oxides and RO are divalentcation oxides.
 11. The glass article of claim 1, wherein the glassarticle is substantially free of alkaline earth metals.
 12. The glassarticle of claim 1, wherein the softening point is less than 800° C. 13.The glass article of claim 1, wherein the softening point is less than775° C.
 14. The glass article of claim 1, wherein the glass article hasa non-planar shape.
 15. The glass article of claim 1, wherein the glassarticle is down drawable.
 16. The glass article of claim 1, wherein SiO₂(mol %)+Al₂O₃(mol %)≤71.97 mol %.
 17. An electronic product, comprisingthe glass article of claim
 1. 18. An glass article, the glass articlecomprising at least about 50 mol % to 60 mol % SiO₂, at least 8 mol %Al₂O₃, at least 1 mol % P₂O₅, about 1 mol % to about 7 mol % ZnO, and atleast 12 mol % Na₂O, wherein the glass article is substantially free ofpotassium prior to being ion exchanged, wherein the glass article is ionexchanged and has a compressive layer extending from a surface of theglass article to a depth of layer within the article, the compressivelayer having a maximum compressive stress of at least about 700 MPa,wherein the glass has a softening point of less than or equal to about825° C. and a high temperature coefficient of thermal expansion of lessthan or equal to 29 ppm/° C., and wherein Al₂O₃(mol %)>P₂O₅(mol%)+B₂O₃(mol %).
 19. The glass article of claim 18, wherein the maximumcompressive stress is at least about 800 MPa.
 20. The glass article ofclaim 19, wherein the maximum compressive stress is at least about 900MPa.
 21. The glass article of claim 18, wherein the depth of layer is atleast 20 μm.
 22. The glass article of claim 18, wherein the glass has aVickers crack initiation threshold of at least about 10 kgf.
 23. Theglass article of claim 18, wherein the glass article comprises: from 10mol % to 20 mol % Al₂O₃;from 1.45 to 8 mol % P₂O₅; from 2 mol % to 10mol % to B₂O₃; and from 14 mol % to 20 mol % Na₂O.
 24. The glass articleof claim 23, wherein the glass article comprises from 1 mol % to 7 mol %ZnO.
 25. The glass article of claim 23, wherein Al₂O₃(mol %)>B₂O₃(mol%), and Na₂O(mol %)>Al₂O₃(mol %).
 26. The glass article of claim 23,wherein 0.3≤[(R₂O(mol %)+RO(mol %)+B₂O₃(mol %)]/[(Al₂O₃(mol %)+P₂O₅ (mol%)+SiO₂ (mol %)]≤0.45, where R₂O are monovalent cation oxides and RO aredivalent cation oxides.
 27. The glass article of claim 18, wherein theglass article is substantially free of at alkaline earth metals.
 28. Theglass article of claim 18, wherein the softening point is less than 800°C.
 29. The glass article of claim 18, wherein the softening point isless than 775° C.
 30. The glass article of claim 18, wherein the glassarticle has a nonplanar shape.
 31. The glass article of claim 18,wherein the glass article is down drawable.
 32. The glass article ofclaim 18, wherein SiO₂ (mol %)+Al₂O₃(mol %)≤71.97 mol %.
 33. Anelectronic product, comprising the glass article of claim 18.